Renesas and GlobalFoundries have announced a significant expansion of their strategic partnership, signing a multi-billion dollar agreement focused on semiconductor manufacturing for automotive and industrial applications.

Under the deal, Renesas gains broader access to GlobalFoundries' differentiated technology platforms, including FDX FD-SOI, BCD, and CMOS+NVM. These processes are designed for producing SoCs, power devices, and MCUs that require high reliability in demanding environments. Initial tape-outs are expected in mid-2026.

Production will leverage GlobalFoundries' global footprint, utilizing its facilities in the U.S., Germany, and Singapore, alongside manufacturing capabilities in China. The companies are also exploring deploying certain GlobalFoundries processes directly in Renesas' own Japanese fabs to enhance supply chain resilience.

Tim Breen, CEO of GlobalFoundries, emphasized the company's role as a reliable partner in key semiconductor technologies. Renesas CEO Hidetoshi Shibata stated the collaboration provides the flexibility and supply security needed to deliver advanced solutions for the rapidly growing markets driven by electrification, connectivity, and AI-powered computing.

ICgoodFind : This expanded partnership between Renesas and GlobalFoundries strategically locks in capacity on critical specialty nodes. By securing access to differentiated processes across a global footprint, Renesas strengthens its supply chain for the high-reliability automotive and industrial markets.