On July 21, Kyocera CEO Shiro Aso stated in a Nikkei interview that the semiconductor equipment parts upcycle will continue through around 2030. Kyocera supplies precision ceramics, capacitors, and ceramic packages critical for fab equipment. The company is currently reviewing a large volume of advance orders to filter real demand.

Optical communication ceramic package orders are now growing even faster than equipment component orders. A new ceramic and semiconductor package plant in Isahaya, Nagasaki, is set to begin production in September 2026. Kyocera also holds multiple idle sites globally, allowing flexible capacity allocation based on mid-to-long-term demand.

To meet AI server-driven passive component demand, Kyocera plans a ¥100 billion (approx. RMB 4.17 billion) mid-term investment to expand miniaturized, high-capacity MLCC production lines.

From ICgoodFind: Ceramics are the silent backbone of semiconductor manufacturing. Kyocera’s 2030 outlook tells you the parts cycle is now synced with AI’s build horizon – and MLCC expansion confirms server demand is real.