Infineon BSC190N15NS3GATMA1: High-Performance OptiMOS™ 5 Power MOSFET for Efficient Power Conversion

Release date:2025-10-29 Number of clicks:57

Infineon BSC190N15NS3GATMA1: High-Performance OptiMOS™ 5 Power MOSFET for Efficient Power Conversion

The relentless pursuit of higher efficiency, power density, and reliability in modern electronics drives continuous innovation in power semiconductor technology. At the forefront of this evolution is Infineon's BSC190N15NS3GATMA1, a benchmark N-channel power MOSFET that exemplifies the advanced capabilities of the OptiMOS™ 5 150 V technology platform. This component is engineered to meet the demanding requirements of contemporary switch-mode power supplies (SMPS), motor control, and power conversion applications.

A primary strength of the BSC190N15NS3GATMA1 lies in its exceptionally low figure-of-merit (R DS(on) x Q G). With a maximum on-state resistance of just 9.8 mΩ, this device minimizes conduction losses, allowing for more efficient power transfer and reduced heat generation. This characteristic is crucial for applications operating at high currents, as it directly translates to higher system efficiency and the potential for smaller heatsinks, reducing both the form factor and total cost of the system.

Complementing its low R DS(on) is the MOSFET's superior switching performance. The OptiMOS™ 5 technology ensures very low gate charge (Q G) and reduced internal capacitances. This enables faster switching speeds, which is paramount for high-frequency operation. By reducing switching losses, designers can push switching frequencies higher, leading to the use of smaller passive components like inductors and transformers. This synergy significantly increases the overall power density of the end application, enabling more compact and lighter designs without sacrificing performance.

The device is housed in a SuperSO8 package (PG-TDSON-8), which offers an optimal balance between thermal performance and board space savings. The package features an exposed thermal pad that provides excellent heat dissipation away from the silicon die, ensuring reliable operation even under high-stress conditions. This robust thermal capability is essential for maintaining long-term reliability and preventing thermal runaway.

Furthermore, the BSC190N15NS3GATMA1 is designed with ruggedness and durability in mind. It offers a wide operating temperature range and is characterized for high avalanche ruggedness, making it a robust and dependable choice for industrial environments, telecom infrastructure, and automotive systems where quality and longevity are non-negotiable.

ICGOOODFIND: The Infineon BSC190N15NS3GATMA1 stands as a top-tier solution for engineers focused on maximizing efficiency and power density. Its industry-leading low on-resistance, fast switching characteristics, and excellent thermal performance make it an ideal cornerstone for next-generation high-efficiency power conversion systems.

Keywords: Power MOSFET, High Efficiency, OptiMOS™ 5, Low R DS(on), Power Density.

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